The **ATS-16H-34-C2-R0** is a specific part number for a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. This component is part of their "push-pin" series designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 6.73°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 25.0mm | | **Fin Type** | Fine Pitch (Cross-Cut) | --- ## 2. Key Components & Electronics Function ### A. The Fin Array The "34" in the part number corresponds to a specific fin geometry. These are **cross-cut fins**, which create a matrix of square pins. * **Purpose:** Increases surface area for heat dissipation. * **Airflow:** Designed for multi-directional airflow, making it versatile for different PCB layouts where air might not flow in a single straight line. ### B. Thermal Interface Material (TIM) This specific model usually comes pre-applied with **Phase Change Material (PCM)** or high-performance thermal tape. * **Function:** Fills microscopic air gaps between the heat source (electronic chip) and the aluminum base to ensure maximum heat transfer. ### C. Attachment Mechanism (Push-Pin & Spring) Unlike adhesive-based heat sinks, this uses a mechanical connection: 1. **Push-Pins:** Plastic rivets that snap into pre-drilled holes on the PCB. 2. **Compression Springs:** These provide a precise "Force-to-Load" ratio. This ensures the heat sink is pressed firmly against the chip without cracking the silicon die. --- ## 3. Part Number Breakdown (Nomenclature) | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **16H** | Series/Version identifier | | **34** | Dimension/Geometry code (35mm x 35mm base) | | **C2** | Thermal Performance/Material Grade | | **R0** | RoHS Compliant / Revision Status | --- ## 4. Typical Applications This component is used in electronic systems where active cooling (fans) or strong passive convection is present: * **Telecommunications:** Network switches and routers. * **Embedded Systems:** Industrial PCs and controllers. * **Power Electronics:** Cooling MOSFET arrays or voltage regulators.