The **ATS-16H-46-C2-R0** is a specific electronic component categorized as a **Heat Sink**, manufactured by **Advanced Thermal Solutions Inc.** It is part of the "pushPIN™" thermal management series, designed to dissipate heat from integrated circuits (ICs) and other electronic components. --- ### Technical Specifications The table below outlines the primary physical and thermal characteristics of the device: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Heat Sink Type** | High-Performance (Fine Pitch) | | **Thermal Resistance** | 11.57°C/W (at 100 LFM) | | **Dimensions (L x W)** | 25.00mm x 25.00mm | | **Height (Off Base)** | 25.00mm | --- ### Component Breakdown #### 1. Thermal Performance The performance of this heat sink depends on the airflow (Linear Feet per Minute - LFM). As airflow increases, the thermal resistance decreases: * **Unducted Flow:** 11.57°C/W @ 100 LFM. * **Ducted Flow:** 2.10°C/W @ 100 LFM. #### 2. Physical Design * **Fin Pitch:** The "Fine Pitch" design provides a larger surface area relative to its footprint, making it ideal for high-density PCB layouts. * **Material:** Aluminum is used for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Finish:** This treatment protects the aluminum from corrosion and slightly improves radiant heat transfer. #### 3. Attachment Mechanism (Push-Pin) The "R0" suffix indicates the mounting hardware. The push-pin system ensures: * **Pre-assembled Attachment:** Comes with a flexible, high-performance thermal interface material (TIM) pre-applied. * **Reliable Pressure:** The spring-loaded pins provide consistent pressure across the component, ensuring optimal thermal contact. --- ### Typical Applications * **BGA (Ball Grid Array) Cooling:** Used on processors, FPGAs, and GPUs. * **Telecommunications:** Used in routers and switches where space is limited. * **Industrial PCs:** Providing cooling for small form-factor motherboards.