The **ATS-17B-88-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic devices like CPUs, GPUs, and power modules. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | Details | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions | Leading provider of thermal management. | | **Attachment Method** | pushPIN™ | Uses a spring-loaded pin for secure mounting. | | **Material** | Aluminum | Lightweight with high thermal conductivity. | | **Finish** | Blue Anodized | Protects against corrosion and improves radiation. | | **Dimensions** | 35 x 35 x 25 mm | Square base with a 25mm height. | | **Thermal Resistance** | 2.30°C/W (Unducted) | Measures efficiency at 200 LFM (Linear Feet per Min). | --- ## 2. Key Component Features ### A. The pushPIN™ Attachment System This part uses a specific mounting mechanism designed to provide the correct pressure (load) on the electronic chip. * **Springs:** Usually made of stainless steel or brass for durability. * **Pins:** Designed to fit through pre-drilled holes in the Printed Circuit Board (PCB). ### B. Fin Design (Straight Fin) The **88 series** typically features a straight-fin design. This is optimized for airflow that moves in a single direction (unidirectional), making it ideal for standard server or desktop chassis airflow. ### C. Thermal Interface Material (TIM) The **"R0"** suffix in the part number indicates the specific thermal pad or grease applied to the base. * **Material:** ATS typically uses **T766** (a high-performance phase-change material) or a similar pre-applied adhesive. * **Purpose:** Fills microscopic air gaps between the heat sink and the electronic component to maximize heat transfer. --- ## 3. Performance Analysis The efficiency of the ATS-17B-88-C2-R0 depends on the airflow velocity measured in Linear Feet per Minute (LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 6.51 | | 200 (1.0 m/s) | 2.30 | | 400 (2.0 m/s) | 1.55 | | 600 (3.0 m/s) | 1.23 | --- ## 4. Application Use Cases This component is commonly used in: * **Telecommunications:** Cooling for high-speed routers and switches. * **Embedded Systems:** Industrial PCs where space is limited but heat output is high. * **Power Supplies:** Cooling MOSFETs or voltage regulators.