The **ATS-17D-137-C2-R0** is a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" series designed specifically for cooling electronic components such as CPUs, GPUs, and other high-heat surface-mount devices. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (with Compression Spring) | | **Base Dimensions** | 70.0mm x 70.0mm | | **Height** | 7.0mm (Low Profile) | | **Thermal Resistance** | 18.28°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Electronic/Physical Components Although a heat sink is a passive component, it consists of several critical "parts" that ensure electronic reliability: ### A. The Heat Sink Body (Fins) * **Design:** It uses a **fine-pitch fin** structure to maximize surface area within a compact 70x70mm footprint. * **Low Profile:** At only 7.0mm tall, it is designed for space-constrained electronics (like 1U rack servers or thin client devices). ### B. The Push-Pin Mechanism * **Material:** Typically plastic or brass pins. * **Springs:** High-tension compression springs ensure a constant, uniform pressure between the heat sink and the electronic chip, which is vital for efficient heat transfer. ### C. Thermal Interface Material (TIM) * **Part Type:** T766. * **Function:** This is a pre-applied phase-change material or grease that fills microscopic air gaps between the component die and the aluminum base. --- ## 3. Thermal Performance Data Performance varies based on the airflow (Linear Feet per Minute) within the electronic enclosure: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 18.28 | | 400 (2.0 m/s) | 13.00 | | 600 (3.0 m/s) | 10.00 | --- ## 4. Typical Applications * **Field Programmable Gate Arrays (FPGAs)** * **Application Specific Integrated Circuits (ASICs)** * **Embedded Computing Boards** * **Network Switches and Routers** ---