ATS-17D-209-C2-R0
AI

The **ATS-17D-209-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) to prevent overheating.
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### 1. Technical Specifications
The part number follows a specific nomenclature used by ATS to describe its dimensions, material, and thermal performance.
| Feature | Specification |
| :--- | :--- |
| **Part Number** | ATS-17D-209-C2-R0 |
| **Heat Sink Type** | pushPIN™ HS Assembly |
| **Fin Style** | Blue Anodized, Straight Fin |
| **Base Material** | Aluminum |
| **Dimensions (L x W x H)** | 70.00mm x 70.00mm x 10.00mm |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 6.27°C/W (at 100 LFM) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Key Components & Design
* **pushPIN™ Attachment:** This model uses a specialized push-pin mechanism rather than adhesive tape or screws. This provides a precise and reliable attachment force (pressure) to ensure optimal contact between the heat sink and the chip.
* **Aluminum Body:** Chosen for its excellent thermal conductivity and lightweight properties.
* **Blue Anodized Finish:** The "C2" in the part number indicates the finish. Anodizing protects the aluminum from corrosion and slightly improves heat radiation.
* **Straight Fin Design:** Optimized for "open-flow" environments where air moves across the fins to carry away heat.
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### 3. Thermal Performance (Airflow)
Thermal resistance indicates how effectively the sink moves heat away from the component. Lower values are better at higher airflows.
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 6.27 |
| 200 (1.0 m/s) | 4.46 |
| 300 (1.5 m/s) | 3.67 |
| 400 (2.0 m/s) | 3.20 |
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### 4. Applications
This specific part is typically found in:
1. **Networking Hardware:** Routers, switches, and high-speed modems.
2. **Embedded Systems:** Industrial PCs and automation controllers.
3. **Power Electronics:** Voltage regulators and power modules that generate significant localized heat.
- ⤷
How do I calculate the required airflow (LFM) for this heat sink in my specific project?
- ⤷ What is the difference between the T766 TIM used here and other thermal pads?
- ⤷ Can the pushPIN attachment be used on any PCB thickness?