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  • ATS-17D-209-C2-R0

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    The **ATS-17D-209-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) to prevent overheating. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to describe its dimensions, material, and thermal performance. | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-17D-209-C2-R0 | | **Heat Sink Type** | pushPIN™ HS Assembly | | **Fin Style** | Blue Anodized, Straight Fin | | **Base Material** | Aluminum | | **Dimensions (L x W x H)** | 70.00mm x 70.00mm x 10.00mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 6.27°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Components & Design * **pushPIN™ Attachment:** This model uses a specialized push-pin mechanism rather than adhesive tape or screws. This provides a precise and reliable attachment force (pressure) to ensure optimal contact between the heat sink and the chip. * **Aluminum Body:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Finish:** The "C2" in the part number indicates the finish. Anodizing protects the aluminum from corrosion and slightly improves heat radiation. * **Straight Fin Design:** Optimized for "open-flow" environments where air moves across the fins to carry away heat. --- ### 3. Thermal Performance (Airflow) Thermal resistance indicates how effectively the sink moves heat away from the component. Lower values are better at higher airflows. | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 6.27 | | 200 (1.0 m/s) | 4.46 | | 300 (1.5 m/s) | 3.67 | | 400 (2.0 m/s) | 3.20 | --- ### 4. Applications This specific part is typically found in: 1. **Networking Hardware:** Routers, switches, and high-speed modems. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Voltage regulators and power modules that generate significant localized heat.
    ✨ Follow-up Questions
    • ⤷ How do I calculate the required airflow (LFM) for this heat sink in my specific project?
    • ⤷ What is the difference between the T766 TIM used here and other thermal pads?
    • ⤷ Can the pushPIN attachment be used on any PCB thickness?