## Overview of ATS-17E-89-C2-R0 The **ATS-17E-89-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **push-pin** attachment series, designed to provide efficient thermal management for electronic components such as CPUs, GPUs, and power modules. --- ### Technical Specifications The following table summarizes the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Heat Sink Type** | Straight Fin | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 30.00mm | | **Thermal Resistance** | 3.94°C/W (at 200 LFM) | | **Flow Orientation** | Vertical/Horizontal (Directional) | --- ### Key Components and Design #### 1. Heat Sink Body Manufactured from high-grade aluminum. Aluminum is chosen for its excellent thermal conductivity-to-weight ratio. The **Blue Anodized** coating is not just aesthetic; it increases thermal emissivity and protects the metal from corrosion. #### 2. Fin Geometry The part features **Straight Fins**. This design is optimized for environments with a steady flow of air (forced convection). Straight fins minimize pressure drop while maximizing the surface area available for heat dissipation. #### 3. Attachment Mechanism (Push-Pins) The "R0" designation refers to the specific attachment kit included. - **Push-Pins:** These provide a secure, vibration-resistant mechanical connection to the PCB. - **Springs:** Pre-assembled springs provide the necessary downward force (compression) to ensure optimal contact between the heat sink and the electronic component. #### 4. Thermal Interface Material (TIM) The "C2" in the part number indicates that the heat sink comes pre-applied with a **Thermal Interface Material**. Specifically, it typically uses the ATS-developed high-performance thermal grease or pad, ensuring that air gaps between the component and the heat sink are eliminated. --- ### Application Usage This specific model is commonly found in: * **Networking Equipment:** Routers and switches. * **Industrial Controls:** Components that generate significant heat in enclosed spaces. * **Embedded Systems:** High-performance SoCs (System on Chips) that require active or robust passive cooling.