The **ATS-17F-14-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and features. --- ### 1. Technical Specifications This part belongs to the **Advanced Thermal Solutions (ATS)** "Blue Ice" or "push-pin" series. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-17F-14-C2-R0 | | **Type** | Board Level Heatsink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Shape** | Square / Rectangular Fin Array | --- ### 2. Physical Dimensions The physical footprint is critical for determining if it will fit on a PCB (Printed Circuit Board) without interfering with other components. * **Length:** 50.00 mm * **Width:** 50.00 mm * **Height (Fin Depth):** 20.00 mm * **Thermal Resistance:** Approximately 9.97°C/W at 100 LFM (Linear Feet per Minute). --- ### 3. Key Electronic/Mechanical Features #### A. Push-Pin Attachment The "-R0" suffix typically denotes the attachment kit. The push-pin mechanism uses a pre-drilled hole in the PCB. * **Springs:** Often includes a compression spring to ensure even pressure across the component surface (TIM - Thermal Interface Material). * **Ease of Assembly:** Allows for quick installation without the need for adhesive tapes or complex brackets. #### B. Thermal Interface Material (TIM) The **"C2"** in the part number indicates the type of thermal interface material pre-applied to the base: * **T766:** A high-performance phase-change thermal pad or grease that fills microscopic air gaps between the heatsink and the chip to maximize heat transfer. #### C. Fin Design The part utilizes a **straight-fin** or **cross-cut** design (depending on the specific sub-series), optimized for airflow. The blue anodized coating not only provides a professional look but also increases surface emissivity, aiding in radiation cooling. --- ### 4. Typical Applications This heatsink is commonly found in: * **Processors (CPUs/GPUs):** For small embedded systems. * **ASICs and FPGAs:** High-speed logic chips that generate significant heat. * **Power Supplies:** Cooling voltage regulators or power transistors. * **Telecommunications:** Used in routers and switches.