ATS-17F-142-C3-R0
AI

## Analysis of Part Number: ATS-17F-142-C3-R0
The part number **ATS-17F-142-C3-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" series, designed for cooling electronic components such as CPUs, GPUs, or other integrated circuits.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of the component:
| Feature | Specification |
| :--- | :--- |
| **Component Type** | Heat Sink |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions** | 30.00mm x 30.00mm |
| **Height (Fin)** | 15.00mm |
| **Attachment Type** | Push-Pin (Brass) |
| **Thermal Interface Material (TIM)** | T412 (Pre-applied) |
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### 2. Thermal Performance
Thermal resistance is measured in °C/W (Degrees Celsius per Watt). A lower number indicates better heat dissipation.
* **Unducted Flow:** 4.95 °C/W @ 200 LFM (Linear Feet per Minute)
* **Ducted Flow:** 2.40 °C/W @ 200 LFM
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### 3. Part Number Breakdown
The nomenclature used by ATS allows for specific identification of the part's features:
| Code Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer: Advanced Thermal Solutions |
| **17** | Series number |
| **F** | Fin Pitch / Style (Fine Pitch) |
| **142** | Specific mechanical design ID |
| **C3** | Thermal Performance/Color/Material code |
| **R0** | Revision code |
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### 4. Mounting & Installation
This specific model uses the **pushPIN™** system, which offers several advantages for electronic assembly:
* **Spring-loaded mechanism:** Ensures consistent pressure on the component for optimal heat transfer.
* **Ease of Install:** No special tools are required; the pins snap into pre-drilled holes in the PCB.
* **Attachment:** Features a brass pin and a stainless steel spring for durability.
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### 5. Application Use Cases
* **Telecommunications:** Cooling of networking chips.
* **Embedded Systems:** Industrial PCs or automation controllers.
* **Power Electronics:** Voltage regulators or power modules that generate localized heat.
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- ⤷
What are the PCB hole size requirements for this push-pin heat sink?
- ⤷ How does the T412 thermal interface material compare to other options like T766?
- ⤷ Is this heat sink available in different heights for low-profile enclosures?