The **ATS-17G-07-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for secure attachment to Printed Circuit Boards (PCBs). ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-17G-07-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 12.70mm | | **Thermal Resistance** | 17.09 °C/W @ (Natural Convection) | | **Fin Type** | Fine Pitch (straight fins) | --- ### Core Components and Features #### 1. Heat Sink Body The main body is constructed from **Aluminum (6063)**, which offers high thermal conductivity. The **Blue Anodized** finish is not just aesthetic; it provides surface protection against corrosion and slightly improves radiant heat transfer. #### 2. Push-Pin Attachment Mechanism Instead of using messy adhesives or thermal tape, this model uses a mechanical fastening system: * **Push-Pins:** Plastic or brass pins that snap into pre-drilled holes in the PCB. * **Springs:** Provides consistent downward pressure (clamping force) on the electronic component (CPU/GPU/FPGA) to ensure optimal contact. #### 3. Thermal Interface Material (TIM) The "R0" designation typically implies the inclusion of a pre-applied **Thermal Interface Material**. In this series, ATS usually applies **T766** phase-change material or a similar high-performance pad to the base of the heat sink to fill microscopic air gaps between the chip and the metal. --- ### Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM) provided by the system fans: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 17.09 | | 300 | 1.5 | 5.30 | | 500 | 2.5 | 3.52 | | 700 | 3.5 | 2.80 | --- ### Usage Guidelines * **Target Components:** Ideal for BGA (Ball Grid Array) packages, Chipsets, and Power Modules. * **PCB Compatibility:** Requires specific hole patterns on the PCB to accommodate the push-pins. The pitch for this model is typically **38.00mm**.