The **ATS-17G-210-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink** assembly. It is manufactured by *Advanced Thermal Solutions (ATS)* as part of their "push-pin" series designed for cooling integrated circuits (ICs) and high-heat components. --- ## 1. Technical Specifications The following table highlights the core physical and thermal properties of this specific model: | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Heat Sink Type** | Push-Pin (Aluminium) | | **Dimensions** | 70mm x 70mm x 12.7mm | | **Fin Style** | XCUT (Cross-cut) | | **Thermal Resistance** | 0.79°C/W (at 200 LFM) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin with Springs | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ## 2. Key Component Features ### A. XCUT Fin Design The "XCUT" geometry means the vertical fins are cross-cut into smaller squares/rectangles. This design: * Allows for **multi-directional airflow**, meaning the heat sink performs well even if the air is not blowing perfectly straight through the fins. * Increases the surface area relative to the volume for better heat dissipation. ### B. Push-Pin Attachment Mechanism Instead of using messy adhesives or permanent solder, this part uses a mechanical push-pin system: * **Plastic/Brass Pins:** Inserted through pre-drilled holes in the PCB. * **Compression Springs:** Ensure consistent downward pressure on the chip, which is vital for maintaining thermal contact. ### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied. This is a "Phase Change Material" or high-quality thermal grease pad that fills microscopic air gaps between the heat sink and the processor, significantly lowering the temperature. --- ## 3. Part Number Breakdown Understanding the nomenclature helps in identifying its specific characteristics: | Code Segment | Meaning | | :--- | :--- | | **ATS-17** | Series (Push-Pin XCUT) | | **G** | Material / Surface Finish (Blue Anodized) | | **210** | Specific Dimensions and Fin Configuration | | **C2** | Thermal Performance Level / TIM Grade | | **R0** | Revision code (Standard RoHS compliance) | --- ## 4. Common Applications This heat sink is typically found in: * **Networking Gear:** Cooling high-speed Switch/Router processors. * **Industrial PCs:** Maintaining stability in high-ambient-temperature environments. * **FPGA Cooling:** Dissipating heat from large Field Programmable Gate Arrays.