The **ATS-17G-34-C2-R0** is a specific electronic cooling component, categorized as a high-performance **Heat Sink**. It is manufactured by **Advanced Thermal Solutions (ATS)** and is part of their "push-pin" series designed for cooling processors and other surface-mount components. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink (Passive Cooling) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | ~6.73°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 25.00mm | | **Fin Style** | Straight Fin | --- ### 2. Physical Design Components * **Fin Structure:** It features high-performance straight fins that provide a large surface area for heat dissipation. The "G" in the part number often refers to the specific fin density and geometry optimized for vertical airflow. * **Push-Pin Attachment:** This model uses a spring-loaded push-pin mechanism. This provides a consistent, pre-determined pressure on the heat source (like a BGA chip), ensuring optimal thermal interface material (TIM) performance. * **Thermal Interface Material (TIM):** Typically, these units come with a pre-applied phase-change material or a high-performance thermal pad on the base to simplify installation. --- ### 3. Application Use Cases This specific heat sink is commonly used in industrial and consumer electronics where airflow is directed across the PCB: * **Networking Equipment:** Routers, switches, and gateways. * **Embedded Systems:** Industrial PCs and Single Board Computers (SBCs). * **Power Supplies:** Cooling MOSFETs or voltage regulators that generate significant heat in a small footprint. --- ### 4. Thermal Performance Context The **C2** designation usually refers to the specific thermal performance grade and material treatment (Blue Anodized), which prevents oxidation and slightly improves radiant heat transfer compared to raw aluminum. ---