The **ATS-17G-49-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to describe its physical and thermal properties. | Specification | Details | | :--- | :--- | | **Product Type** | pushPIN™ Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Spring-loaded) | | **Thermal Resistance** | 26.36°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 25mm x 25mm x 10mm | | **Fin Style** | Fine Pitch (Square Pattern) | --- ### 2. Breakdown of the Part Number To understand the specific features, the part number can be decoded as follows: - **ATS-17**: The series identifier (pushPIN™ series). - **G**: Indicates the specific attachment hole spacing or bracket type. - **49**: Refers to the physical dimensions/profile code. - **C2**: Refers to the thermal performance and material (typically Aluminum with a specific fin density). - **R0**: Indicates the revision number or specific packaging/coating. --- ### 3. Key Electronic Functions While the heat sink itself is passive (it does not require electricity to run), it is critical for the following electronic functions: 1. **Thermal Dissipation**: It increases the surface area of the component (e.g., an Integrated Circuit), allowing air to carry heat away more efficiently. 2. **Junction Temperature Control**: It prevents the "Junction Temperature" of a semiconductor from exceeding its safe operating limit (usually 125°C - 150°C), preventing thermal throttling or permanent damage. 3. **Mechanical Attachment**: The "Push Pin" system ensures constant, even pressure on the chip, which optimizes the interface between the chip surface and the thermal interface material (TIM). --- ### 4. Implementation Requirements To use this part effectively in a PCB design, the following are required: - **Pre-drilled Holes**: The PCB must have two holes spaced correctly to accommodate the push pins. - **Thermal Interface Material (TIM)**: A thermal pad or grease must be applied between the chip and the heat sink base to fill microscopic air gaps. - **Airflow**: This specific model is designed for "Forced Air" environments (where a fan is present) due to its high fin density.