## Technical Specifications: ATS-17G-53-C2-R0 The **ATS-17G-53-C2-R0** is a high-performance **Heat Sink** assembly designed by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** product line, specifically engineered for cooling electronic components like CPUs, GPUs, and FPGAs in environments with constrained airflow. --- ### 1. General Product Details | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Category** | Passive Cooling / Heat Sinks | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Material** | Aluminum (Body) / Blue Anodized (Finish) | | **Interface Material** | T766 (Thermal Interface Material pre-applied) | --- ### 2. Physical Dimensions This heat sink features a high-aspect-ratio fin design to maximize surface area for heat dissipation. * **Length:** 30.00 mm * **Width:** 30.00 mm * **Height:** 25.00 mm (Vertical profile) * **Fin Pitch:** Fine pitch for optimized airflow. --- ### 3. Thermal Performance The efficiency of the ATS-17G-53-C2-R0 depends heavily on the velocity of the air passing through the fins (measured in Linear Feet per Minute - LFM). | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 8.57 | | **400 (2.0 m/s)** | 4.69 | | **600 (3.0 m/s)** | 3.62 | | **800 (4.0 m/s)** | 3.09 | --- ### 4. Key Electronic Components & Features 1. **maxiFLOW™ Fin Geometry:** The unique "flared" fin design reduces pressure drop and increases the surface area for radiant and convective cooling. This is critical for high-density PCB layouts where air might be blocked by other components. 2. **pushPIN™ Mounting System:** Unlike simple adhesive tapes, this part uses a mechanical push-pin system. This ensures a consistent **pressure** between the heat sink and the electronic chip, which is vital for maintaining low thermal resistance over time. 3. **Pre-applied TIM (Thermal Interface Material):** The unit comes with **T766** pre-applied to the base. This eliminates the need for manual thermal paste application and ensures a bubble-free connection to the component die. 4. **Hardware (Springs):** Uses brass/plastic pins with stainless steel springs to provide reliable attachment force without damaging the PCB. --- ### 5. Common Applications * **Networking Gear:** Switches and Routers. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or voltage regulators. ---