ATS-17G-75-C1-R0
AI

The **ATS-17G-75-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power semiconductors.
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### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics.
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Base Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic or Brass) |
| **Dimensions** | 25mm x 25mm x 10mm |
| **Thermal Resistance** | 14.95°C/W (at 100 LFM) |
| **Flow Pattern** | Straight Fin |
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### 2. Physical Design Features
* **Straight Fin Geometry:** This design allows for consistent airflow through the fins, making it ideal for systems with directed air movement (forced convection).
* **Low Profile:** With a height of only 10mm, it is suitable for tight spaces in server racks, telecommunications gear, or compact embedded systems.
* **Push-Pin Attachment:** Instead of messy thermal glue or tape, this part uses a mechanical push-pin and spring mechanism. This provides:
* **Consistent Pressure:** Ensures optimal contact with the chip for better heat transfer.
* **Ease of Rework:** Can be removed and reattached easily during maintenance.
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### 3. Material and Finish
The component is made from **Aluminum 6063**, which offers a balance between thermal conductivity and weight. The **Blue Anodized finish** serves two purposes:
1. **Corrosion Resistance:** Protects the aluminum from oxidation.
2. **Increased Emissivity:** Slightly improves the radiative heat transfer compared to raw aluminum.
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### 4. Thermal Performance
The efficiency of this heat sink is highly dependent on the airflow (measured in Linear Feet per Minute - LFM):
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (Natural/Low) | 14.95 |
| 200 | 7.62 |
| 500 | 4.32 |
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- ⤷
What is the hole pattern required on the PCB for this heat sink?
- ⤷ Are there different spring tensions available for the push-pin mechanism?
- ⤷ How does this compare to the 'cross-cut' fin version of the same size?