## Technical Overview: ATS-17G-84-C2-R0 The **ATS-17G-84-C2-R0** is a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed to provide efficient cooling for electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance (Flowing)** | 1.15 °C/W @ 200 LFM | | **Thermal Resistance (Static)** | 7.00 °C/W (Ductless) | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 35.00mm | | **Fin Style** | Straight Fin | --- ### 2. Physical Components & Parts The assembly of the ATS-17G-84-C2-R0 consists of three primary electronic cooling sub-components: #### A. The Heat Sink Body * **Material:** Made of high-grade aluminum for lightweight thermal conductivity. * **Fin Design:** A high-aspect-ratio straight-fin design that maximizes surface area for convective cooling. * **Anodization:** The blue anodized coating prevents oxidation and slightly increases surface emissivity. #### B. The Attachment Mechanism (Push-Pins) * **Components:** This model uses a spring-loaded push-pin system. * **Function:** It eliminates the need for messy adhesives or permanent solder. The pins provide consistent pressure across the interface to ensure optimal thermal contact. #### C. Thermal Interface Material (TIM) * **Phase Change Material:** The part typically comes pre-applied with **ATS-PPS-02** or a similar high-performance thermal pad. * **Role:** It fills microscopic air gaps between the heat sink and the electronic chip to facilitate better heat transfer. --- ### 3. Thermal Performance Profile The effectiveness of this part depends heavily on the airflow (Linear Feet per Minute - LFM) within the electronic enclosure: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 9.00 | | 200 | 1.15 | | 400 | 0.85 | | 600 | 0.70 | --- ### 4. Application Use Cases This specific part is widely used in: 1. **Telecommunications:** Cooling network switches and routers. 2. **Embedded Systems:** For industrial PCs and automation controllers. 3. **Power Electronics:** Cooling MOSFETs or power regulators. ---