The **ATS-17H-33-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for thermal management in compact electronic assemblies. --- ## 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-17H-33-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 17.78mm | | **Thermal Resistance** | 1.74 °C/W (at 200 LFM) | | **Airflow Design** | XC-Cut (Cross-cut) | --- ## 2. Key Component Features ### A. The pushPIN™ Attachment System The "R0" suffix indicates the use of the **pushPIN™** mounting system. - **Spring Mechanism:** It uses a brass or plastic pin with a precise compression spring. - **Reliability:** This provides a secure, vibration-resistant attachment to the PCB. - **Pre-drilled Holes:** The PCB must have specific hole spacing to accommodate the pins. ### B. XC-Cut Fin Design Unlike straight-fin heat sinks, the XC-Cut (cross-cut) design features a grid-like pattern. - **Multi-directional Flow:** It allows air to enter and exit from multiple directions, making it ideal for enclosures where airflow direction is not strictly linear. - **Increased Surface Area:** The cross-cuts increase the total surface area for heat dissipation without significantly increasing the footprint. ### C. Thermal Interface Material (TIM) This specific model usually comes with a pre-applied **Phase Change Material** or high-performance thermal pad. This ensures that the microscopic gaps between the heat sink and the electronic component (CPU, GPU, or FPGA) are filled to maximize heat transfer. --- ## 3. Application Use Cases This part is commonly found in the following electronic environments: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Embedded Systems:** Used in compact industrial PCs. 3. **Power Electronics:** Managing heat for MOSFETs or power regulators on a PCB. ---