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  • ATS-17H-46-C2-R0

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    ## Analysis of ATS-17H-46-C2-R0 The **ATS-17H-46-C2-R0** is a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed for effective thermal management in electronic systems. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 11.74 °C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 25.00 mm x 25.00 mm | | **Height** | 25.00 mm | | **Pitch** | Fine-Pitch | | **Pattern** | Square | --- ### Key Components and Design Features #### 1. Thermal Performance This heat sink is designed to dissipate heat from surface-mount components (like CPUs, FPGAs, or MOSFETs). The thermal resistance decreases as airflow increases: * **100 LFM (0.5 m/s):** 11.74 °C/W * **500 LFM (2.5 m/s):** 3.13 °C/W * **700 LFM (3.5 m/s):** 2.54 °C/W #### 2. The pushPIN™ Attachment System Instead of using messy adhesives or permanent solder, this part uses a mechanical fastening system: * **Springs:** Pre-assembled with a precise compression force to ensure consistent contact with the component. * **Pins:** Available in plastic or copper (this model typically uses brass/plastic pins) that snap into pre-drilled holes on the PCB. #### 3. Material and Coating * **Aluminum 6063:** Provides a high strength-to-weight ratio and excellent thermal conductivity. * **Blue Anodized Finish:** Protects the aluminum from corrosion and slightly increases emissivity for better radiant heat transfer. * **TIM (Thermal Interface Material):** Usually comes pre-applied with **ATS-PPS-17** (or similar T766 phase-change material) on the base to fill microscopic air gaps between the chip and the heat sink. --- ### Application Use Cases * **Telecommunications:** Cooling of high-speed networking chips. * **Embedded Systems:** Small form factor PCs or industrial controllers. * **Power Electronics:** Dissipating heat from voltage regulators or motor drivers. ---
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the pushPIN attachment system?
    • ⤷ How does the height of 25mm affect the thermal performance compared to shorter models?
    • ⤷ Is the pre-applied thermal interface material (TIM) replaceable or permanent?