Motore di ricerca datesheet componenti elettronici
  Italian  ▼
ALLDATASHEETIT.COM

X  

  • ATS-17H-63-C2-R0

  • AI
    The **ATS-17H-63-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-17H-63-C2-R0 | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (with Springs) | | **Thermal Resistance** | 2.85°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | --- ### 2. Physical Design Features * **Fin Style:** This model typically features a **cross-cut** or **straight fin** design (depending on the specific sub-configuration of the series), optimized for vertical airflow. * **Push-Pin Attachment:** Instead of messy adhesives or thermal tape, this part uses a mechanical push-pin system. This ensures consistent pressure across the interface for better heat transfer. * **C2 Material Grade:** The "C2" designation often refers to the specific aluminum alloy and thermal interface material (TIM) pre-applied to the base. --- ### 3. Application Use Cases This part is commonly found in the following electronic systems: 1. **Telecommunications:** Cooling of networking chips in routers and switches. 2. **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high. 3. **Power Electronics:** Dissipating heat from Voltage Regulators (VRMs) or MOSFETs. 4. **Processors:** Cooling small form-factor CPUs or Field Programmable Gate Arrays (FPGAs). --- ### 4. Thermal Performance Breakdown Thermal resistance is the critical metric for this part. It determines how many degrees Celsius the component temperature will rise per watt of power dissipated. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Low Airflow) | 2.85 | | 300 (Medium Airflow) | 1.45 | | 500 (High Airflow) | 1.10 | ---
    ✨ Follow-up Questions
    • ⤷What is the difference between the C1
    • ⤷ C2
    • ⤷ and C3 variants in the ATS-17H series?
    • ⤷ How do I calculate if 2.85°C/W is sufficient for my specific electronic component?
    • ⤷ What type of Push-Pin material is used for the ATS-17H-63-C2-R0?