ATS-17H-63-C2-R0
AI

The **ATS-17H-63-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Part Number** | ATS-17H-63-C2-R0 |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (with Springs) |
| **Thermal Resistance** | 2.85°C/W (at 100 LFM) |
| **Dimensions (L x W x H)** | 40mm x 40mm x 20mm |
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### 2. Physical Design Features
* **Fin Style:** This model typically features a **cross-cut** or **straight fin** design (depending on the specific sub-configuration of the series), optimized for vertical airflow.
* **Push-Pin Attachment:** Instead of messy adhesives or thermal tape, this part uses a mechanical push-pin system. This ensures consistent pressure across the interface for better heat transfer.
* **C2 Material Grade:** The "C2" designation often refers to the specific aluminum alloy and thermal interface material (TIM) pre-applied to the base.
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### 3. Application Use Cases
This part is commonly found in the following electronic systems:
1. **Telecommunications:** Cooling of networking chips in routers and switches.
2. **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high.
3. **Power Electronics:** Dissipating heat from Voltage Regulators (VRMs) or MOSFETs.
4. **Processors:** Cooling small form-factor CPUs or Field Programmable Gate Arrays (FPGAs).
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### 4. Thermal Performance Breakdown
Thermal resistance is the critical metric for this part. It determines how many degrees Celsius the component temperature will rise per watt of power dissipated.
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (Low Airflow) | 2.85 |
| 300 (Medium Airflow) | 1.45 |
| 500 (High Airflow) | 1.10 |
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- ⤷What is the difference between the C1
- ⤷ C2
- ⤷ and C3 variants in the ATS-17H series?
- ⤷ How do I calculate if 2.85°C/W is sufficient for my specific electronic component?
- ⤷ What type of Push-Pin material is used for the ATS-17H-63-C2-R0?