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  • ATS-17H-71-C2-R0

  • AI
    The **ATS-17H-71-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 6.69°C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 30.00mm | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Core Components & Features #### A. The pushPIN™ Attachment System The "R0" suffix refers to the specific attachment kit. This part uses a specialized **pushPIN™** system that includes: * **Compression Springs:** Ensures consistent pressure (clamping force) across the component for optimal heat transfer. * **Plastic/Brass Push Pins:** Designed to lock into pre-drilled holes on the Printed Circuit Board (PCB). #### B. Material and Coating * **Aluminum Construction:** Offers a balance between weight and thermal conductivity. * **Blue Anodized Finish:** Not only provides aesthetic value but also increases corrosion resistance and surface emissivity (improving radiation heat transfer). #### C. Fin Design (High Performance) The **Straight Fin** design is optimized for **forced air cooling** (environments with fans). The vertical blades provide a large surface area for air to pass through, stripping away heat from the baseplate. --- ### 3. Thermal Performance Data Thermal resistance indicates how effectively the device moves heat. Lower values are better. | Airflow Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Resistance (°C/W)** | 11.60 | 6.69 | 4.81 | 3.85 | 3.30 | --- ### 4. Applications This part is typically found in: * **Telecommunications:** Network switches and routers. * **Industrial PCs:** High-heat embedded systems. * **Power Supplies:** Cooling voltage regulators or MOSFETs.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole diameter requirements for the pushPIN system?
    • ⤷ Is there a copper version of this heat sink for better conductivity?
    • ⤷ How does the T766 thermal interface material compare to standard thermal paste?