ATS-17H-71-C2-R0
AI

The **ATS-17H-71-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of the part:
| Characteristic | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 6.69°C/W (at 200 LFM) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 30.00mm |
| **Fin Style** | Straight Fin |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Core Components & Features
#### A. The pushPIN™ Attachment System
The "R0" suffix refers to the specific attachment kit. This part uses a specialized **pushPIN™** system that includes:
* **Compression Springs:** Ensures consistent pressure (clamping force) across the component for optimal heat transfer.
* **Plastic/Brass Push Pins:** Designed to lock into pre-drilled holes on the Printed Circuit Board (PCB).
#### B. Material and Coating
* **Aluminum Construction:** Offers a balance between weight and thermal conductivity.
* **Blue Anodized Finish:** Not only provides aesthetic value but also increases corrosion resistance and surface emissivity (improving radiation heat transfer).
#### C. Fin Design (High Performance)
The **Straight Fin** design is optimized for **forced air cooling** (environments with fans). The vertical blades provide a large surface area for air to pass through, stripping away heat from the baseplate.
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### 3. Thermal Performance Data
Thermal resistance indicates how effectively the device moves heat. Lower values are better.
| Airflow Velocity (LFM) | 100 | 200 | 300 | 400 | 500 |
| :--- | :--- | :--- | :--- | :--- | :--- |
| **Resistance (°C/W)** | 11.60 | 6.69 | 4.81 | 3.85 | 3.30 |
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### 4. Applications
This part is typically found in:
* **Telecommunications:** Network switches and routers.
* **Industrial PCs:** High-heat embedded systems.
* **Power Supplies:** Cooling voltage regulators or MOSFETs.
- ⤷
What are the PCB hole diameter requirements for the pushPIN system?
- ⤷ Is there a copper version of this heat sink for better conductivity?
- ⤷ How does the T766 thermal interface material compare to standard thermal paste?