The **ATS-17H-77-C2-R0** is a specific model of a **High-Performance Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their *push-pin* attachment series designed to cool electronic components like CPUs, GPUs, or high-power ASICs. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (with springs) | | **Dimensions (L x W x H)** | 25mm x 25mm x 30mm | | **Thermal Resistance** | 9.30°C/W (at 100 LFM) | | **Interface Material** | T766 (Thermal Tape) | --- ### 2. Breakdown of the Model Number The part number identifies several key physical and performance characteristics: * **ATS-17**: The series designation for ATS push-pin heat sinks. * **H**: High-performance fin density. * **77**: The specific size and fin configuration code. * **C2**: Material and Finish code (typically refers to Aluminum with Blue Anodized finish). * **R0**: Version/Revision number. --- ### 3. Key Features 1. **Push-Pin Attachment**: It uses a flexible, spring-loaded push-pin mechanism. This ensures constant pressure between the heat sink and the component, optimizing thermal transfer without the need for tools. 2. **Cross-Cut Fin Design**: The "fins" are not just straight lines; they are often cut in a way that allows air to flow from any direction (omni-directional), which is ideal for systems with complex airflow. 3. **Pre-applied Thermal Interface Material (TIM)**: It comes with **T766** thermal tape already applied to the base, making it "peel-and-stick" ready for production lines. 4. **Material**: Made of 6063 aluminum for a balance between weight, cost, and thermal conductivity. --- ### 4. Thermal Performance Thermal resistance indicates how effectively the part moves heat away from the chip. Performance varies based on airflow (LFM - Linear Feet per Minute): * **@ 100 LFM (0.5 m/s):** 9.30 °C/W * **@ 300 LFM (1.5 m/s):** 5.10 °C/W * **@ 700 LFM (3.5 m/s):** 3.70 °C/W --- ### 5. Common Applications * **Embedded Systems**: Small form-factor industrial PCs. * **Telecommunications**: Cooling chipsets in routers and switches. * **Power Supplies**: Dissipating heat from MOSFETs or voltage regulators.