The **ATS-17H-85-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ## 1. Technical Specifications Below is a breakdown of the core physical and thermal properties: | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-17H-85-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 35.00mm x 35.00mm x 10.00mm | | **Thermal Resistance** | 23.98 °C/W @ (0.5 m/s) | | **Flow Pattern** | Straight Fin (Cross-Cut) | --- ## 2. Key Design Features ### A. pushPIN™ Attachment System This part uses a proprietary spring-loaded mechanism rather than simple adhesive. * **Benefits:** Provides high reliability, consistent pressure across the interface, and ease of assembly. * **Hardware:** It typically includes pre-drilled holes for brass or plastic pins and stainless steel springs. ### B. Material & Coating * **Aluminum 6063:** Chosen for its excellent thermal conductivity and structural integrity. * **Blue Anodized Finish:** Not just for aesthetics; the anodized layer provides corrosion resistance and slightly improves radiative heat transfer. ### C. Thermal Interface Material (TIM) The "R0" at the end of the part number usually indicates the specific version of the thermal interface material or packaging. Most ATS heat sinks in this series come with **T412** or similar phase-change material pre-applied to the base for immediate installation. --- ## 3. Performance Analysis The efficiency of the ATS-17H-85-C2-R0 depends heavily on the airflow (measured in Linear Feet per Minute - LFM): * **Low Airflow (200 LFM):** Significant drop in thermal resistance, allowing for better cooling. * **Passive Cooling:** Due to the 10mm height, it is considered a "Low Profile" heat sink, making it suitable for compact enclosures where vertical space is limited. --- ## 4. Typical Applications * **Embedded Systems:** Industrial PCs and IoT gateways. * **Networking:** Small routers, switches, and SFP modules. * **Power Electronics:** Voltage regulators and MOSFETs in power supplies.