The **ATS-18A-145-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing heat sinks to Printed Circuit Boards (PCBs). ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-18A-145-C2-R0 | | **Heat Sink Type** | Push-Pin | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 30.00mm | | **Fin Style** | Straight (Standard) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Attachment Method** | Plastic Push-Pin (Spring-loaded) | --- ### 2. Key Components & Design Features #### A. Material and Finish * **Aluminum Construction:** Provides a lightweight solution with high thermal conductivity to dissipate heat away from the semiconductor. * **Blue Anodized Coating:** The blue anodization is not just for aesthetics; it increases the surface emissivity, slightly improving radiation heat transfer and protecting the aluminum from corrosion. #### B. Attachment Mechanism (Push-Pin) This model uses a **spring-loaded push-pin** system. * **Ease of Assembly:** It allows for quick installation on the PCB without the need for specialized tools. * **Pressure Management:** The springs ensure consistent downward pressure on the electronic component (CPU, GPU, or FPGA), which optimizes the performance of the Thermal Interface Material (TIM). #### C. Thermal Interface Material (TIM) * **T766:** This specific model comes with **T766** phase-change material pre-applied to the base. This eliminates the need for manual thermal paste application and ensures there are no air gaps between the heat sink and the chip. --- ### 3. Thermal Performance Thermal resistance is measured in °C/W (Degrees Celsius per Watt). The performance of the ATS-18A-145-C2-R0 varies based on the airflow (velocity) within the electronic enclosure: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (Unducted) | 2.90 | | 400 (Unducted) | 1.70 | | 600 (Unducted) | 1.42 | --- ### 4. Typical Applications * **Integrated Circuits (ICs):** Cooling high-speed processors or chipsets. * **Telecommunications:** Used in routers and switches. * **Power Supplies:** Managing heat in compact power conversion modules. * **Embedded Systems:** Industrial PCs where space is limited but vertical height (30mm) is available. ---