The **ATS-18A-164-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "Blue Anodized" series designed for cooling electronic components such as BGA (Ball Grid Array) packages, CPUs, or GPUs. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 33.00mm | | **Fin Type** | Straight Fin | | **Fin Pitch** | Fine Pitch | | **Thermal Resistance** | 2.41°C/W (@ 1.0 m/s airflow) | --- ## 2. Key Electronic & Mechanical Features ### A. pushPIN™ Attachment System This heat sink uses a specific "pushPIN" mechanism rather than thermal adhesive. This provides several advantages for electronic assemblies: * **Constant Pressure:** Ensures optimal contact between the heat sink and the component surface. * **Secure Fit:** Prevents the heat sink from shifting during vibration or shipping. * **Ease of Rework:** Can be removed and reattached easily compared to permanent epoxy. ### B. Thermal Performance The "C2" in the part number indicates the thermal interface material (TIM) or the specific coating. In this case, it usually refers to a high-performance **thermal interface material** pre-applied to the base to bridge the microscopic air gaps between the chip and the aluminum. ### C. Airflow Optimization The straight-fin design is optimized for systems with a directional fan. It allows air to pass through the fins with minimal resistance, effectively wicking heat away from sensitive silicon dies. --- ## 3. Application Use Cases * **Telecommunications:** Cooling network switches and routers. * **Industrial PC:** Heat dissipation for embedded processors. * **Power Supplies:** Cooling MOSFETs or power modules. * **Gaming/Graphics:** Secondary cooling for VRMs or memory chips. ---