ATS-18A-82-C3-R0
AI

The **ATS-18A-82-C3-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heat Sink** designed for cooling electronic components like CPUs, GPUs, or power transistors.
Below is a detailed breakdown of its specifications and electronic application.
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### 1. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum (Anodized Blue) |
| **Attachment Method** | Push-Pin (Plastic or Brass) |
| **Thermal Resistance** | 25.10°C/W (Unducted Flow) |
| **Dimensions** | 30mm x 30mm x 25mm |
| **Fin Style** | Straight Fin |
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### 2. Physical Design Elements
* **Heat Sink Profile:** The "82" in the part number corresponds to a specific height and fin configuration. With a 25mm height, it is designed for medium-profile cooling in confined electronic enclosures.
* **pushPIN™ Attachment:** Unlike adhesive tapes, this part uses a mechanical push-pin system with a compression spring. This ensures consistent pressure between the heat sink and the electronic chip, which optimizes thermal transfer.
* **Material Finish:** The blue anodized coating is not just for aesthetics; it provides surface protection and slightly improves radiation heat transfer.
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### 3. Electronic Performance Data
In electronics, thermal management is measured by how effectively the part moves heat away from the junction of a semiconductor.
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 25.10 |
| 300 (1.5 m/s) | 7.20 |
| 500 (2.5 m/s) | 5.01 |
**Key Takeaway:** As shown in the table, this part is highly dependent on active airflow. Its efficiency increases significantly (resistance drops from 25.1 to 5.01) when a fan is introduced to the system.
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### 4. Typical Applications
* **Embedded Systems:** Industrial PCs and controllers.
* **Telecommunications:** Network switches and routers.
* **Power Supplies:** Cooling MOSFETs or Voltage Regulators.
* **Development Boards:** High-performance ARM-based SOCs (System on Chips).
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- ⤷What is the difference between ducted and unducted thermal resistance for this part?
- ⤷ Which spring types are compatible with the push-pin system used here?
- ⤷ Can this heat sink be used with a standard 30mm fan?