The **ATS-18B-126-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 15.00mm | | **Thermal Resistance (Unducted)** | 5.47 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.66 °C/W @ 100 LFM | | **Fin Type** | High-performance Pattern | --- ### 2. Key Electronic Components & Features #### A. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a mechanical **pushPIN™** system. - **Spring Mechanism:** Provides precise pressure (Force) to ensure maximum contact between the component and the heat sink. - **Reliability:** It is more vibration-resistant than thermal tape, making it ideal for industrial or automotive electronics. #### B. Thermal Interface Material (TIM) The "C2" in the part number typically indicates that a high-performance **T766 thermal phase change material** is pre-applied to the base. This material fills microscopic air gaps between the chip and the aluminum base to lower thermal impedance. #### C. Fin Geometry The "126" series features a specific fin pitch and height (15mm) designed for low-profile enclosures where vertical space is limited but surface area for cooling is still required. --- ### 3. Application Use Cases This specific heat sink is commonly found in: 1. **Networking Equipment:** Switches and routers where airflow is constant but space is tight. 2. **Embedded Systems:** Single-board computers (SBCs) or FPGA modules. 3. **Power Electronics:** Voltage regulators or motor drivers requiring passive or active cooling. --- ### 4. Thermal Performance Comparison Below is an example of how thermal resistance decreases as airflow (measured in Linear Feet per Minute - LFM) increases: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 5.47 | | 300 | 1.5 | 2.50 | | 500 | 2.5 | 1.90 | | 700 | 3.5 | 1.60 |