## Technical Analysis of ATS-18B-155-C2-R0 The **ATS-18B-155-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed for cooling electronic components like CPUs, GPUs, or power transistors. ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-pin (Brass) | | **Thermal Resistance (Unducted)** | 5.37 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.50 °C/W @ 100 LFM | | **Thermal Interface Material (TIM)** | T766 (High Performance) | --- ### 2. Physical Dimensions The part is characterized by its "XC" (Extra-Cut) pattern, which provides a high surface area for heat dissipation. * **Length (A):** 40.00 mm * **Width (B):** 40.00 mm * **Height (C):** 20.00 mm * **Pitch (E):** 33.00 mm (Distance between mounting holes) * **Pitch (F):** 33.00 mm --- ### 3. Core Electronic/Thermal Features * **Push-Pin Mounting:** This model uses a brass push-pin mechanism with a compression spring. This ensures consistent pressure on the electronic component (IC), which optimizes thermal transfer between the chip and the heat sink. * **Fin Design:** It features a **Straight-Fin** or **Cross-Cut** geometry (depending on specific sub-series) designed to allow air to flow from any direction, making it versatile for different PCB layouts. * **Pre-applied TIM:** The "T766" designation indicates that a high-quality thermal grease or pad is pre-applied to the base, reducing assembly time and ensuring a reliable thermal bond. * **Material Efficiency:** Being made of aluminum with a blue anodized finish, it offers a balance of lightweight construction and high corrosion resistance. --- ### 4. Typical Applications This specific part is used in scenarios where electronic components generate significant heat but have limited space: 1. **Networking Hardware:** Routers, switches, and gateways. 2. **Industrial PCs:** Compact embedded systems. 3. **Power Electronics:** Voltage regulators and motor drivers.