ATS-18D-130-C2-R0
AI

The **ATS-18D-130-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for precision cooling of electronic components like CPUs, GPUs, and high-power chipsets.
---
### 1. Technical Specifications
The part number encodes specific physical and material properties:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 5.23°C/W (at 100 LFM) |
| **Dimensions (L x W)** | 35.00 mm x 35.00 mm |
| **Height (Fin)** | 15.00 mm |
| **Fin Pattern** | Fine Pitch (Cross-Cut) |
---
### 2. Key Components & Construction
#### A. The Fin Profile
The heat sink utilizes a **cross-cut** design. This allows for multi-directional airflow, making it highly effective in compact enclosures where air may not flow in a perfectly straight line. The fine pitch increases the total surface area for heat dissipation.
#### B. The pushPIN™ Attachment
Unlike adhesive-based heat sinks, this model uses a mechanical attachment system:
* **Plastic Push Pins:** Used to secure the heat sink to the PCB through pre-drilled holes.
* **Compression Springs:** These provide "Precise Force" (measured in Grams/mm) to ensure uniform pressure across the component (the TIM), maximizing heat transfer.
#### C. Thermal Interface Material (TIM)
The "R0" at the end of the part number indicates that the heat sink comes pre-applied with **T766** thermal phase change material. This eliminates the need for manual application of thermal paste and ensures a high-quality thermal bond.
---
### 3. Usage Context
This part is typically used in industrial and telecommunications hardware where reliability is critical. Because it uses a mechanical attachment, it is vibration-resistant compared to "peel-and-stick" heat sinks, making it ideal for:
* Embedded systems.
* Network switches and routers.
* Power supply modules.
---
- ⤷
What are the PCB hole requirements for installing the pushPIN system?
- ⤷ How does the thermal resistance change at higher airflow (e.g.
- ⤷ 500 LFM)?
- ⤷ Is it possible to customize the fin height or material for this specific series?