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  • ATS-18D-130-C2-R0

  • AI
    The **ATS-18D-130-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for precision cooling of electronic components like CPUs, GPUs, and high-power chipsets. --- ### 1. Technical Specifications The part number encodes specific physical and material properties: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 5.23°C/W (at 100 LFM) | | **Dimensions (L x W)** | 35.00 mm x 35.00 mm | | **Height (Fin)** | 15.00 mm | | **Fin Pattern** | Fine Pitch (Cross-Cut) | --- ### 2. Key Components & Construction #### A. The Fin Profile The heat sink utilizes a **cross-cut** design. This allows for multi-directional airflow, making it highly effective in compact enclosures where air may not flow in a perfectly straight line. The fine pitch increases the total surface area for heat dissipation. #### B. The pushPIN™ Attachment Unlike adhesive-based heat sinks, this model uses a mechanical attachment system: * **Plastic Push Pins:** Used to secure the heat sink to the PCB through pre-drilled holes. * **Compression Springs:** These provide "Precise Force" (measured in Grams/mm) to ensure uniform pressure across the component (the TIM), maximizing heat transfer. #### C. Thermal Interface Material (TIM) The "R0" at the end of the part number indicates that the heat sink comes pre-applied with **T766** thermal phase change material. This eliminates the need for manual application of thermal paste and ensures a high-quality thermal bond. --- ### 3. Usage Context This part is typically used in industrial and telecommunications hardware where reliability is critical. Because it uses a mechanical attachment, it is vibration-resistant compared to "peel-and-stick" heat sinks, making it ideal for: * Embedded systems. * Network switches and routers. * Power supply modules. ---
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for installing the pushPIN system?
    • ⤷ How does the thermal resistance change at higher airflow (e.g.
    • ⤷ 500 LFM)?
    • ⤷ Is it possible to customize the fin height or material for this specific series?