ATS-18E-01-C2-R0
AI

The **ATS-18E-01-C2-R0** is a specific electronic component primarily classified as a **High-Performance Heat Sink**. It is manufactured by **Advanced Thermal Solutions (ATS)** and belongs to their "push pin" attachment series.
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## 🛠️ Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-18E-01-C2-R0 |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Brass) |
| **Thermal Resistance** | 21.93°C/W (at 200 LFM) |
| **Flow Orientation** | Vertical Fin (Straight) |
| **Dimensions (L x W x H)** | 40mm x 40mm x 6mm |
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## 🧩 Key Components and Design Features
### 1. The Heat Sink Body
* **Material:** Made from high-grade aluminum for optimal thermal conductivity.
* **Low Profile:** With a height of only **6mm**, it is designed for space-constrained electronic assemblies (1U servers or thin clients).
* **Fin Pattern:** Features a straight-fin design which is optimized for forced air cooling (airflow from a fan).
### 2. Attachment Mechanism (Push-Pin)
Unlike adhesive-based heat sinks, this model uses a **push-pin and compression spring** system.
* **Reliability:** Provides consistent pressure on the processor, ensuring maximum heat transfer.
* **Hardware:** Includes brass push-pins and stainless steel springs to resist vibration and mechanical shock.
### 3. Thermal Interface Material (TIM)
* The "C2" in the part number indicates that the unit typically comes with **pre-applied thermal interface material**.
* This ensures a low-resistance thermal path between the electronic component (like a CPU, GPU, or FPGA) and the aluminum base.
### 4. Blue Anodized Finish
* The finish is not just aesthetic; anodizing increases the surface emissivity and protects the aluminum from environmental corrosion.
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## 💻 Typical Applications
This part is commonly found in:
* **Networking Hardware:** Switches and routers.
* **Embedded Systems:** Industrial PCs where vertical space is limited.
* **Power Supplies:** Cooling voltage regulators or power transistors.
* **Small Form Factor (SFF) Computing:** Cooling chipsets on motherboards.
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- ⤷
What is the hole pattern spacing required for the push-pin installation?
- ⤷ How does the thermal resistance change at higher airflows (LFM)?
- ⤷ Are there alternative heights available for the ATS-18E series?