ATS-18E-35-C2-R0
AI

The **ATS-18E-35-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW" series, designed for high-performance thermal management of electronic integrated circuits (ICs).
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### 1. Technical Specifications
Below is a breakdown of the physical and thermal properties of this specific part:
| Characteristic | Specification |
| :--- | :--- |
| **Component Type** | Heat Sink |
| **Attachment Method** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 10.0mm |
| **Fin Style** | maxiFLOW (Tapered Fin) |
| **Thermal Resistance** | 12.48°C/W (Unducted Flow @ 200 LFM) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Key Electronic Features
#### A. pushPIN™ Attachment
Unlike adhesive tapes that can fail under high heat, this part uses the **pushPIN™ system**. This involves a spring-loaded mechanism that ensures:
* **Constant Pressure:** Maintains a secure contact between the heat sink and the processor.
* **Easy Installation:** Simplifies assembly on the PCB (Printed Circuit Board) using pre-drilled holes.
#### B. maxiFLOW™ Fin Design
The fins on the ATS-18E-35-C2-R0 are not standard straight fins. They use a **tapered design** which:
* Reduces pressure drop across the component.
* Increases surface area for heat dissipation.
* Optimizes airflow in constrained electronic housings.
#### C. Thermal Interface Material (TIM)
The part comes with **T766** pre-applied. This is a high-performance thermal pad/grease that fills microscopic air gaps between the chip and the heat sink, significantly improving the heat transfer efficiency.
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### 3. Application Use Cases
This part is typically used to cool the following electronic components:
1. **BGA (Ball Grid Array) Packages:** Common in networking gear and processors.
2. **ASICs & FPGAs:** High-speed chips that generate significant localized heat.
3. **Power Supplies:** Specifically for cooling voltage regulators.
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### 4. Part Number Decoder
Understanding the "ATS-18E-35-C2-R0" nomenclature:
* **ATS:** Advanced Thermal Solutions (Manufacturer).
* **18:** Series Identifier.
* **35:** Width/Length (35mm).
* **C2:** Thermal Interface Material / Color code (Blue Anodized).
* **R0:** Revision or Packaging code.
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What is the difference between ducted and unducted thermal resistance for this part?
- ⤷ Are there specific PCB hole patterns required for the pushPIN™ attachment?
- ⤷ Can this heat sink be used with a custom thermal interface material instead of T766?