## Technical Overview: ATS-18E-40-C2-R0 The **ATS-18E-40-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, designed specifically for high-efficiency cooling of electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 1.45°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Component Breakdown #### A. The Heat Sink Body (Design) The unit features a **spread fin pattern**. Unlike traditional straight-fin heat sinks, the maxiFLOW™ design uses a flared fin geometry that maximizes surface area while maintaining a low pressure drop. This is critical for high-density electronic enclosures where airflow may be limited. #### B. The Attachment Mechanism (pushPIN™) The "R0" at the end of the part number indicates the mounting hardware. * **Hardware:** It utilizes a **pushPIN™** system, which consists of a plastic or brass pin and a compression spring. * **Benefit:** This ensures consistent pressure across the component surface, optimizing heat transfer and preventing damage to the PCB. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. * **Function:** T766 is a high-performance phase-change material that fills microscopic air gaps between the component and the heat sink base. * **Advantage:** Eliminates the need for manual thermal paste application, ensuring uniform thickness and reliability. --- ### 3. Thermal Performance Data Performance varies based on air velocity (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 1.45 | | **400 (2.0 m/s)** | 0.90 | | **600 (3.0 m/s)** | 0.70 | --- ### 4. Application Use-Cases * **Networking Gear:** Switches and routers where horizontal airflow is common. * **Industrial PCs:** Cooling embedded processors in tight spaces. * **Power Supplies:** Heat dissipation for MOSFETs and power regulators.