The part number **ATS-18E-85-C2-R0** refers to a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). While it is not an active electronic component like a transistor, it is a critical thermal management part used to protect sensitive electronics from overheating. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin (Brass) | | **Fin Type** | Fine Pitch (Cross-cut) | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 10.0mm | | **Thermal Resistance** | 23.98 °C/W (at 100 LFM) | | **Finish** | Blue Anodized | | **Interface Material** | T766 (Thermal Interface Material) | --- ### Key Components & Design Features #### 1. Push-Pin Mounting System The **"18E"** and **"R0"** indicators relate to the specific mounting hardware. This model uses a push-pin mechanism designed to provide the necessary pressure to ensure maximum heat transfer between the component (like a BGA chip) and the heat sink. #### 2. Fine-Pitch Fin Design The fins are designed with a "Cross-cut" or "Fine Pitch" geometry. This increases the surface area significantly within a small footprint, allowing for better heat dissipation in airflow-constrained environments. #### 3. Material and Finish * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized:** The surface treatment improves corrosion resistance and emissivity, slightly increasing heat radiation. #### 4. Pre-Applied Thermal Interface Material (TIM) The unit comes with **T766** pre-applied. This is a "Phase Change" or high-performance thermal pad that fills microscopic air gaps between the chip and the heat sink to reduce thermal resistance. --- ### Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **18E** | Series and attachment type | | **85** | Specific footprint/fin configuration | | **C2** | Blue Anodized finish | | **R0** | Revision or packaging code | --- ### Typical Applications * **Network Switches/Routers:** Cooling processors or ASICs. * **Embedded Computing:** Protecting CPUs on small form factor boards. * **Industrial Controls:** Managing heat in power-dense modules.