The **ATS-18E-87-C2-R0** is a specific electronic component primarily classified as a **High-Performance Heat Sink**. It is manufactured by **Advanced Thermal Solutions (ATS)** as part of their "pushPIN™" heat sink assembly line. Below is a detailed breakdown of its electronic and mechanical specifications. --- ## 1. Technical Specifications This component is designed to dissipate heat from electronic integrated circuits (ICs) such as CPUs, GPUs, or FPGAs. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-18E-87-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 1.31°C/W (at 100 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Number of Fins** | Straight Fin | | **Dimension (Length x Width)** | 35mm x 35mm | | **Height** | 20mm | --- ## 2. Component Composition The "electronic" functionality of this part is passive, meaning it does not require electricity to operate but is critical for the thermal management of active electronics. ### A. Material Science * **Aluminum 6063:** This alloy is used for its high thermal conductivity and structural integrity. * **Blue Anodized Coating:** This is not just for aesthetics; it provides surface protection against corrosion and increases thermal emissivity, helping the part radiate heat more effectively. ### B. Thermal Interface Material (TIM) * The **"R0"** suffix usually indicates the inclusion of a pre-applied thermal interface material. * The interface helps eliminate air gaps between the heat sink and the electronic chip, ensuring maximum heat transfer. ### C. Mounting Mechanism (pushPIN™) * **Compression Springs:** These provide a precise amount of force to ensure the heat sink remains in contact with the component during vibration or thermal expansion. * **Plastic/Brass Push Pins:** These lock into the PCB (Printed Circuit Board) through pre-drilled holes. --- ## 3. Performance Analysis The efficiency of this part depends on the airflow (Linear Feet per Minute - LFM) within the electronic enclosure. | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Unducted) | 1.31 | | 200 (Unducted) | 0.80 | | 300 (Unducted) | 0.63 | | 400 (Unducted) | 0.54 | --- ## 4. Typical Applications * **Network Switches:** Cooling high-speed processors. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. * **Embedded Systems:** Industrial PCs where active cooling (fans) might not be feasible.