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  • ATS-18E-97-C2-R0

  • AI
    The **ATS-18E-97-C2-R0** is a specific electronic component belonging to the **Thermal Management** category. It is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*, specifically from their "pushPIN™" line. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-18E-97-C2-R0 | | **Heat Sink Type** | Push-pin Heat Sink (Blue Anodized) | | **Material** | Aluminum (AL6063) | | **Fin Style** | Straight Fin | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring (Stainless Steel) | | **Interface Material** | T766 (Thermal Grease) | ### 2. Physical Dimensions Precision measurements are critical for PCB layout planning: * **Size (L x W):** 45.00 mm x 45.00 mm * **Height:** 10.00 mm * **Hole Pattern:** 38.00 mm (center-to-center) ### 3. Thermal Performance Thermal resistance determines how effectively the part dissipates heat away from the electronic component (CPU, FPGA, or MOSFET). | Airflow Velocity | Thermal Resistance (Unducted) | Thermal Resistance (Ducted) | | :--- | :--- | :--- | | **@ 100 LFM (0.5 m/s)** | 20.30 °C/W | 3.60 °C/W | | **@ 300 LFM (1.5 m/s)** | 6.70 °C/W | 2.10 °C/W | | **@ 500 LFM (2.5 m/s)** | 4.40 °C/W | 1.60 °C/W | --- ### 4. Key Electronic Applications This part is designed for components that generate significant heat in tight vertical spaces: 1. **Network Switches/Routers:** Cooling high-speed processing chips. 2. **Embedded Systems:** Use in industrial PCs where vertical clearance is limited (only 10mm high). 3. **Power Supplies:** Heat dissipation for surface-mount power transistors. ### 5. Part Number Decoding The suffix provides specific details about the finish and material: * **C2:** Refers to the "Blue Anodized" finish, which increases surface area slightly and provides corrosion resistance. * **R0:** Indicates the revision or RoHS compliance status.
    ✨ Follow-up Questions
    • ⤷ What are the advantages of push-pin mounting over adhesive thermal tape?
    • ⤷ How does the 'Ducted' thermal resistance differ from 'Unducted' in a real-world chassis?
    • ⤷ Is there a version of this heat sink with a higher vertical profile for better cooling?