ATS-18E-97-C2-R0
AI

The **ATS-18E-97-C2-R0** is a specific electronic component belonging to the **Thermal Management** category. It is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*, specifically from their "pushPIN™" line.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of the component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Part Number** | ATS-18E-97-C2-R0 |
| **Heat Sink Type** | Push-pin Heat Sink (Blue Anodized) |
| **Material** | Aluminum (AL6063) |
| **Fin Style** | Straight Fin |
| **Attachment Method** | Push-Pin (Brass) |
| **Spring Type** | Compression Spring (Stainless Steel) |
| **Interface Material** | T766 (Thermal Grease) |
### 2. Physical Dimensions
Precision measurements are critical for PCB layout planning:
* **Size (L x W):** 45.00 mm x 45.00 mm
* **Height:** 10.00 mm
* **Hole Pattern:** 38.00 mm (center-to-center)
### 3. Thermal Performance
Thermal resistance determines how effectively the part dissipates heat away from the electronic component (CPU, FPGA, or MOSFET).
| Airflow Velocity | Thermal Resistance (Unducted) | Thermal Resistance (Ducted) |
| :--- | :--- | :--- |
| **@ 100 LFM (0.5 m/s)** | 20.30 °C/W | 3.60 °C/W |
| **@ 300 LFM (1.5 m/s)** | 6.70 °C/W | 2.10 °C/W |
| **@ 500 LFM (2.5 m/s)** | 4.40 °C/W | 1.60 °C/W |
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### 4. Key Electronic Applications
This part is designed for components that generate significant heat in tight vertical spaces:
1. **Network Switches/Routers:** Cooling high-speed processing chips.
2. **Embedded Systems:** Use in industrial PCs where vertical clearance is limited (only 10mm high).
3. **Power Supplies:** Heat dissipation for surface-mount power transistors.
### 5. Part Number Decoding
The suffix provides specific details about the finish and material:
* **C2:** Refers to the "Blue Anodized" finish, which increases surface area slightly and provides corrosion resistance.
* **R0:** Indicates the revision or RoHS compliance status.
- ⤷
What are the advantages of push-pin mounting over adhesive thermal tape?
- ⤷ How does the 'Ducted' thermal resistance differ from 'Unducted' in a real-world chassis?
- ⤷ Is there a version of this heat sink with a higher vertical profile for better cooling?