The **ATS-18G-22-C2-R0** is a specific part number for a **High-Performance Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW™" product line, designed for cooling electronic components such as BGA (Ball Grid Array) packages. ### 1. Technical Specifications The following table details the mechanical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-18G-22-C2-R0 | | **Material** | Aluminum (Al) | | **Fin Style** | maxiFLOW (Tapered Fin) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 15.00mm | | **Thermal Resistance (Unducted)** | 2.50 °C/W @ 200 LFM | | **Finish** | Blue Anodized | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Electronic & Mechanical Features #### A. The maxiFLOW™ Design The heat sink features a unique tapered fin design. Unlike standard square fins, these fins are angled to increase the surface area while decreasing pressure drop. This allows for maximum heat dissipation in systems where airflow may be limited or constrained. #### B. pushPIN™ Attachment System This part uses a specific mounting mechanism: * **Precision Springs:** Ensures consistent pressure across the interface for optimal heat transfer. * **Hardware:** Includes a brass or plastic pin and a stainless steel spring. * **Compatibility:** Designed for PCB holes (typically 3.0mm diameter) to ensure the sink is securely fastened during vibration or shipping. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the presence of **T766 thermal grease**. This is pre-applied to the base of the heat sink, eliminating the need for manual application and ensuring a low-resistance path between the electronic chip (CPU, FPGA, etc.) and the aluminum sink. --- ### 3. Typical Applications This component is generally used to cool high-power semiconductor devices in the following sectors: 1. **Telecommunications:** Network switches and routers. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Data Centers:** Server motherboards and storage arrays. 4. **Power Electronics:** Cooling for MOSFET arrays or voltage regulators. ---