ATS-18G-48-C2-R0
AI

The **ATS-18G-48-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from surface-mount components like BGA (Ball Grid Array) chips or CPUs.
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### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics:
| Specification | Details |
| :--- | :--- |
| **Product Type** | Heat Sink (Top Mount) |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | Push-Pin (Plastic) with Compression Spring |
| **Dimensions** | 30.00mm x 30.00mm |
| **Height** | 25.00mm |
| **Thermal Resistance** | ~4.45 °C/W (at 200 LFM) |
| **Interface Material** | T766 (Thermal Tape) |
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### 2. Key Features
* **High-Performance Fin Design:** It typically utilizes "cross-cut" or high-density fin patterns to maximize surface area for convective cooling.
* **Push-Pin Mounting:** Features a pre-assembled push-pin and spring mechanism. This ensures consistent pressure on the component, improving thermal transfer compared to simple adhesive methods.
* **Thermal Interface Material (TIM):** Comes pre-applied with a thermal pad or tape (typically T766), reducing assembly time and ensuring a reliable bond.
* **Durability:** The blue anodized finish provides corrosion resistance and increased emissivity.
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### 3. Applications
This part is commonly used in industrial and telecommunications hardware where heat density is high but space is constrained:
1. **Network Switches/Routers:** Cooling high-speed processing chips.
2. **Embedded Systems:** For industrial PCs (IPCs) requiring passive or active airflow cooling.
3. **Power Supplies:** Managing heat for MOSFETs or power ICs.
4. **FPGA/ASIC Cooling:** Protecting logic devices from thermal throttling.
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### 4. Part Number Breakdown (Example)
* **ATS:** Advanced Thermal Solutions (Manufacturer)
* **18G:** Series designation
* **48:** Dimension/Fin configuration code
* **C2:** Material/Finish code (Blue Anodized)
* **R0:** Revision or Packaging code
- ⤷
What is the thermal resistance of this heat sink at different airflow speeds (LFM)?
- ⤷ How does the push-pin mounting compare to adhesive thermal tape in terms of reliability?
- ⤷ Are there CAD models available for integrating this part into a PCB layout?