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  • ATS-18G-48-C2-R0

  • AI
    The **ATS-18G-48-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from surface-mount components like BGA (Ball Grid Array) chips or CPUs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Specification | Details | | :--- | :--- | | **Product Type** | Heat Sink (Top Mount) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic) with Compression Spring | | **Dimensions** | 30.00mm x 30.00mm | | **Height** | 25.00mm | | **Thermal Resistance** | ~4.45 °C/W (at 200 LFM) | | **Interface Material** | T766 (Thermal Tape) | --- ### 2. Key Features * **High-Performance Fin Design:** It typically utilizes "cross-cut" or high-density fin patterns to maximize surface area for convective cooling. * **Push-Pin Mounting:** Features a pre-assembled push-pin and spring mechanism. This ensures consistent pressure on the component, improving thermal transfer compared to simple adhesive methods. * **Thermal Interface Material (TIM):** Comes pre-applied with a thermal pad or tape (typically T766), reducing assembly time and ensuring a reliable bond. * **Durability:** The blue anodized finish provides corrosion resistance and increased emissivity. --- ### 3. Applications This part is commonly used in industrial and telecommunications hardware where heat density is high but space is constrained: 1. **Network Switches/Routers:** Cooling high-speed processing chips. 2. **Embedded Systems:** For industrial PCs (IPCs) requiring passive or active airflow cooling. 3. **Power Supplies:** Managing heat for MOSFETs or power ICs. 4. **FPGA/ASIC Cooling:** Protecting logic devices from thermal throttling. --- ### 4. Part Number Breakdown (Example) * **ATS:** Advanced Thermal Solutions (Manufacturer) * **18G:** Series designation * **48:** Dimension/Fin configuration code * **C2:** Material/Finish code (Blue Anodized) * **R0:** Revision or Packaging code
    ✨ Follow-up Questions
    • ⤷ What is the thermal resistance of this heat sink at different airflow speeds (LFM)?
    • ⤷ How does the push-pin mounting compare to adhesive thermal tape in terms of reliability?
    • ⤷ Are there CAD models available for integrating this part into a PCB layout?