The **ATS-18G-70-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for securing cooling solutions to PCBs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum (with Blue Anodized Finish) | | **Attachment Method** | Push Pin (Plastic) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Fin Type** | Fine Pitch (straight fins) | | **Thermal Resistance** | ~3.64°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Components & Construction #### A. The Heat Sink Body * **Material:** Constructed from high-grade aluminum to balance weight and thermal conductivity. * **Fin Geometry:** Features a "fine-pitch" design which increases the surface area for heat dissipation. This makes it ideal for environments with forced air (fans). * **Finish:** The Blue Anodized coating is not just aesthetic; it provides corrosion resistance and increases surface emissivity for better radiation cooling. #### B. Push Pin Attachment * **Mechanism:** Uses a spring-loaded plastic push pin system. * **Advantage:** It ensures a constant, high-pressure contact between the heat sink and the electronic component (like a CPU or FPGA), which improves thermal transfer and eliminates the need for messy adhesives. #### C. Thermal Interface Material (TIM) * **T766:** The unit comes with a pre-applied layer of T766. This is a high-performance phase-change material or grease that fills microscopic air gaps between the component and the heat sink. --- ### 3. Common Applications This part is typically used to cool high-heat-generating integrated circuits (ICs) in the following sectors: * **Telecommunications:** Cooling routers and switches. * **Computing:** Protecting CPUs and GPUs in industrial PCs. * **Power Electronics:** Dissipating heat from high-speed transistors or power modules. --- ### 4. Thermal Performance Comparison Typical thermal resistance values based on airflow (LFM - Linear Feet per Minute): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 3.64 | | 200 | 2.14 | | 300 | 1.46 | | 400 | 1.15 |