ATS-18G-75-C1-R0
AI

The **ATS-18G-75-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, which is designed for high-density electronic cooling applications.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of the part:
| Characteristic | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W)** | 36.9mm x 41.2mm |
| **Height** | 5.84mm (Low Profile) |
| **Attachment Method** | pushPIN™ |
| **Thermal Resistance** | 14.31 °C/W @ 200 LFM |
| **Fin Style** | Straight (maxiFLOW) |
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### 2. Key Design Components
#### A. The maxiFLOW™ Fin Pattern
The part features a unique spread-fin design. Unlike standard rectangular heat sinks, the fins on this model taper outward. This increases the surface area and encourages turbulent airflow, which significantly improves thermal dissipation efficiency compared to traditional straight-fin designs.
#### B. pushPIN™ Attachment System
This specific model uses the **pushPIN™** mounting mechanism.
- It includes a pre-assembled brass pin and a stainless steel spring.
- This ensures a precise "compression force" is applied to the electronic chip, maximizing the effectiveness of the Thermal Interface Material (TIM).
- It provides a more secure mechanical connection than simple adhesive tapes.
#### C. Thermal Interface Material (TIM)
The "C1" in the part number indicates that this unit comes with **ATS-54** pre-applied. This is a high-performance thermal pad or grease that fills microscopic air gaps between the heat sink and the component (like a CPU, FPGA, or GPU).
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### 3. Applications
The ATS-18G-75-C1-R0 is typically used in space-constrained electronic environments:
* **Telecommunications:** Network switches and routers.
* **Embedded Systems:** Industrial PCs and single-board computers.
* **Power Electronics:** Cooling MOSFETs or power regulators where vertical clearance is limited (only 5.84mm high).
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- ⤷
What are the alternative attachment methods to pushPIN for this series?
- ⤷ How does 'Blue Anodized' finish impact the thermal performance?
- ⤷ Is there a version of this heat sink with a higher profile for better cooling?