ATS-18G-84-C2-R0
AI

The **ATS-18G-84-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed for cooling high-power semiconductors.
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### 1. Technical Specifications
Below are the primary mechanical and thermal specifications for this part:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Blue Anodized Aluminum |
| **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 25.00mm |
| **Thermal Resistance** | 1.15°C/W (at 200 LFM) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Fin Style** | Straight Fin / maxiFLOW™ |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Design Characteristics
This part is engineered for high-efficiency heat dissipation in constrained spaces:
* **maxiFLOW™ Geometry:** The fin profile is designed to maximize surface area while creating a lower pressure drop, allowing air to flow through the sink more efficiently.
* **pushPIN™ Attachment:** It uses a spring-loaded mechanism that ensures even pressure across the electronic component (like a CPU or GPU). This prevents the heat sink from tilting and ensures optimal contact with the Thermal Interface Material (TIM).
* **T766 Thermal Interface:** The part comes with a pre-applied phase-change material that fills microscopic air gaps between the component and the heat sink, significantly reducing thermal resistance.
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### 3. Application Use Cases
This specific heat sink is typically used in industrial and high-speed electronic environments:
* **Networking Hardware:** Switches, routers, and high-capacity modems.
* **Power Supplies:** Cooling MOSFETs or IGBTs in high-density power modules.
* **Embedded Computing:** Cooling high-performance FPGAs or ASICs where airflow is directed through a chassis.
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### 4. Thermal Performance Data
Performance varies based on airflow (measured in Linear Feet per Minute - LFM):
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| **1.0 m/s (200 LFM)** | 1.15 |
| **2.0 m/s (400 LFM)** | 0.85 |
| **3.0 m/s (600 LFM)** | 0.70 |
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What are the different types of pushPIN attachment options for this model?
- ⤷ How does the T766 TIM compare to standard thermal grease?
- ⤷ Can this heat sink be used with a custom fan shroud?