The **ATS-18H-124-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. ### 1. Technical Specifications Below are the key mechanical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 3.18°C/W @ 100 LFM (approximate) | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W)** | 50.00mm x 50.00mm | | **Height** | 25.00mm | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the physical attributes of the heat sink: * **ATS**: Manufacturer prefix (Advanced Thermal Solutions). * **18H**: Denotes the specific fin pattern and series. * **124**: Refers to the physical dimensions and mounting hole spacing. * **C2**: Indicates the thermal interface material (TIM) or specific coating (Blue Anodized). * **R0**: Version or revision code. --- ### 3. Key Features & Components #### A. Fin Design The "18H" series typically utilizes a **Straight Fin** or **Cross-Cut** pattern. This design maximizes surface area for air contact while maintaining a low pressure drop, making it ideal for systems with forced-air cooling (fans). #### B. Mounting System (pushPIN™) The "pushPIN™" system is a hardware mechanism designed for fast and secure attachment. * It consists of a **flexible spring** and a **plastic pin**. * It provides constant pressure on the electronic component, ensuring better contact with the Thermal Interface Material (TIM). #### C. Thermal Interface Material (TIM) Most ATS models ending in "C2" come pre-applied with a high-performance thermal pad or grease. This fills the microscopic air gaps between the component and the heat sink base to enhance heat transfer. --- ### 4. Application Usage This part is commonly found in: * **Telecommunications:** High-speed routers and switches. * **Industrial PC:** Embedded controllers that run in high-temperature environments. * **Power Supplies:** Cooling voltage regulators and MOSFETs.