The **ATS-18H-178-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic) | | **Thermal Resistance** | 4.82 °C/W @ 1.0 m/s (approximate) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 25.00mm | | **Fin Style** | Straight Fin | --- ### ### Key Electronic Design Features 1. **Thermal Performance (Efficiency):** The "C2" in the part number indicates a specific thermal profile. This heat sink is designed to maximize surface area to dissipate heat away from a semiconductor junction into the surrounding air. At a typical airflow of 200 LFM (Linear Feet per Minute), it significantly lowers the operating temperature of the chip. 2. **Push Pin Attachment:** This part uses a spring-loaded push pin mechanism. In electronic PCB design, this requires two pre-drilled holes in the motherboard. The springs provide precise, consistent pressure on the component, which optimizes the thermal interface material (TIM) performance. 3. **Blue Anodized Finish:** Beyond aesthetics, the anodized coating increases the surface emissivity, which slightly improves heat radiation and protects the aluminum from environmental corrosion. 4. **Material Composition:** It is made from **AL6063**, a standard aluminum alloy for electronics cooling due to its high thermal conductivity and lightweight properties. --- ### ### Application Considerations * **Component Compatibility:** Best suited for BGA (Ball Grid Array) packages measuring between 30mm and 35mm. * **Vertical Clearance:** Ensure your chassis has at least 25mm of height clearance above the PCB. * **Airflow Direction:** As a straight-fin heat sink, it performs most efficiently when the airflow is directed parallel to the fins.