The **ATS-18H-210-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for thermal management of electronic components like CPUs, GPUs, and other high-heat-density integrated circuits. --- ## 1. Technical Specifications The part number provides specific details about the dimensions, material, and thermal performance. | Parameter | Value | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 5.18°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 70.00 mm x 70.00 mm | | **Height (H)** | 12.00 mm | | **Pitch (Mounting)** | 63.00 mm | --- ## 2. Key Components & Design ### A. Material and Finish * **Aluminum 6063:** This alloy is chosen for its excellent thermal conductivity and structural integrity. * **Blue Anodized Finish:** This chemical treatment increases corrosion resistance and surface emissivity, slightly improving radiant heat transfer. ### B. pushPIN™ Attachment System This specific model uses a hardware-based attachment rather than adhesive. * **Spring-loaded Pins:** These ensure consistent pressure (load) on the component, which optimizes the thermal interface material (TIM) performance. * **Plastic or Brass Pins:** Depending on the specific sub-version, these pins snap into pre-drilled holes on the PCB. ### C. Thermal Interface Material (TIM) * The "-R0" suffix typically indicates that the part comes with **no pre-applied thermal interface material** or a standard thermal pad. However, most ATS-C2 series parts are designed to be used with high-performance thermal grease or phase-change materials to bridge the gap between the heat source and the aluminum base. --- ## 3. Performance Metrics (Airflow) The efficiency of this heat sink is highly dependent on the velocity of the air moving through its fins. | Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 5.18 | 3.62 | 2.99 | 2.61 | 2.36 | --- ## 4. Typical Applications * **PCB Components:** High-speed processors or FPGAs. * **Power Electronics:** Power supplies or motor controllers requiring a low-profile cooling solution (12mm height). * **Telecommunications:** Network switches and routers where vertical space is limited.