The **ATS-18H-32-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Series** | maxiFLOW™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W x H)** | 57.00mm x 57.00mm x 12.70mm | | **Thermal Resistance** | 21.46°C/W (Unducted Flow @ 200 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Design Characteristics #### A. Fin Geometry The "maxiFLOW" design features a flared fin structure. This geometry is engineered to: * Increase the surface area for heat exchange. * Reduce pressure drop as air passes through the fins. * Maximize airflow efficiency in constrained electronic enclosures. #### B. pushPIN™ Attachment Unlike adhesive tapes that can degrade over time, this part uses a **pushPIN™** system. * **Benefits:** Provides consistent pressure to ensure optimal contact with the heat source. * **Components:** It typically includes a brass or plastic pin and a high-performance compression spring. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. * This is a phase-change or high-conductivity thermal pad that fills microscopic air gaps between the component (chip) and the heat sink, ensuring efficient heat transfer. --- ### 3. Thermal Performance Matrix Thermal resistance ($R_{th}$) determines how well the part moves heat away from the electronics. | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 21.46 | | 400 (2.0 m/s) | 11.77 | | 600 (3.0 m/s) | 6.58 | | 800 (4.0 m/s) | 4.31 | --- ### 4. Application Use Cases This specific heat sink is typically found in: * **Networking Equipment:** High-speed routers and switches. * **Industrial PCs:** Compact systems requiring passive or active cooling. * **Power Supplies:** Cooling MOSFETs or power regulators. * **Embedded Systems:** Protecting processors from thermal throttling.