ATS-18H-49-C2-R0
AI

The **ATS-18H-49-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of this specific part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Thermal Resistance** | 2.63°C/W (at 100 LFM) |
| **Dimensions (L x W x H)** | 25mm x 25mm x 20mm |
| **Fin Style** | Straight Fin |
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### 2. Core Components & Design Features
#### A. The Fin Profile
The part features a **straight fin** design. Straight fins are optimized for unidirectional airflow. By increasing the surface area of the aluminum, the heat sink allows air moving through the system to carry away thermal energy more efficiently.
#### B. pushPIN™ Attachment Mechanism
This part utilizes the proprietary **pushPIN™** system. Instead of using messy thermal adhesives that can be difficult to remove, it uses a spring-loaded plastic pin.
* **Benefits:** Provides consistent pressure (clamped load) across the component for better thermal transfer.
* **Installation:** Requires pre-drilled holes in the Printed Circuit Board (PCB).
#### C. Thermal Interface Material (TIM)
The "R0" suffix generally indicates that the part comes with a **pre-applied thermal interface material**. This is a thin layer of thermal grease or a pad that fills microscopic air gaps between the heat sink and the electronic chip, ensuring maximum heat conductivity.
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### 3. Application Use Cases
Due to its small footprint (25mm x 25mm), the ATS-18H-49-C2-R0 is typically used for:
* **Embedded Systems:** Industrial PCs and small form factor boards.
* **Telecommunications:** Networking switches and routers.
* **Power Electronics:** Voltage regulators and motor drivers that generate localized heat.
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### 4. Part Number Breakdown
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Advanced Thermal Solutions (Brand) |
| **18H** | Specific series/height configuration |
| **49** | Fin pattern/count code |
| **C2** | Aluminum material with Blue Anodized finish |
| **R0** | Pre-applied Thermal Interface Material |
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How do I calculate the required LFM (Linear Feet per Minute) for this heat sink?
- ⤷ What are the PCB hole diameter requirements for the pushPIN attachment?
- ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied TIM?