## Technical Analysis of ATS-18H-50-C2-R0 The **ATS-18H-50-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for efficient cooling of electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Thermal Resistance** | 1.88 °C/W (at 100 LFM) | | **Product Type** | Square Heat Sink | --- ### 2. Physical Dimensions The part follows a specific sizing convention to ensure compatibility with standard PCB layouts. * **Width/Length (A x B):** 35mm x 35mm * **Height (C):** 15mm * **Hole Pattern (E x F):** 40mm x 40mm * **Weight:** ~35g --- ### 3. Component Design & Features The "C2" and "R0" designations in the part number refer to specific material and environmental standards: * **Fin Design:** It features a **Straight Fin** pattern, which is optimized for airflow in a specific direction. This design allows for maximum surface area while maintaining a low profile. * **Push Pin Attachment:** Unlike adhesive-based heat sinks, this uses a spring-loaded push pin system. * *Benefits:* Provides consistent pressure for better thermal interface material (TIM) performance and allows for easy removal/rework. * **Thermal Interface Material (TIM):** Typically comes pre-applied with **T766** (or similar) phase-change material or thermal grease to ensure immediate installation readiness. * **Compliance:** Fully **RoHS** (Restriction of Hazardous Substances) and **REACH** compliant. --- ### 4. Thermal Performance Comparison Thermal resistance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 1.88 | | 300 | 1.5 | 1.13 | | 500 | 2.5 | 0.94 | --- ### 5. Application Areas * **Integrated Circuits (ICs):** Cooling FPGAs and ASICs in networking equipment. * **Power Supplies:** Heat dissipation for VRMs (Voltage Regulator Modules). * **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high.