The **ATS-18H-58-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like BGA (Ball Grid Array) packages, CPUs, or GPUs. --- ### ## Technical Specifications The following table outlines the physical and thermal properties of the device: | Property | Value / Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Base Part Number** | ATS-18H-58-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 40.00 mm x 40.00 mm | | **Height (Fin Depth)** | 20.00 mm | | **Mounting Type** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 10.11°C/W (@ 100 LFM) | | **Attachment Method** | pushPIN™ | --- ### ## Key Electronic & Physical Features ### 1. Thermal Interface Material (TIM) This specific model usually comes with **T766** pre-applied thermal interface material. This ensures low thermal resistance between the heat-generating component (the chip) and the aluminum heat sink. ### 2. pushPIN™ Attachment System The "18H" in the part number indicates a specific hardware configuration. The pushPIN™ system uses a flexible spring-loaded mechanism that provides: * **Uniform Pressure:** Ensures the heat sink sits flat against the chip for maximum heat transfer. * **Ease of Assembly:** Quick installation into pre-drilled holes on the PCB. ### 3. Fin Design (Cross-Cut) The unit features a **straight fin** or **cross-cut** design. This allows for multi-directional airflow, making it effective in systems where the cooling fan might not be blowing directly in one linear path. ### 4. Thermal Resistance Ratings Thermal performance varies based on airflow (Measured in Linear Feet per Minute - LFM): * **@ 100 LFM:** 10.11°C/W * **@ 500 LFM:** 3.58°C/W * **@ 700 LFM:** 3.10°C/W --- ### ## Applications This component is typically found in: * **Telecommunications:** Cooling network switches and routers. * **Industrial PCs:** Maintaining stability in embedded systems. * **Power Supplies:** Dissipating heat from high-speed transistors.