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  • ATS-18H-93-C2-R0

  • AI
    The **ATS-18H-93-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 40mm x 40mm | | **Height** | 20mm | | **Thermal Resistance** | 4.37°C/W (at 100 LFM) | | **Fin Pattern** | Straight Fin | --- ### 2. Key Design Elements #### A. The pushPIN™ Attachment System The "R0" at the end of the part number indicates the attachment hardware. This model uses a **pushPIN™** system which features: * **Integrated Springs:** Provides a specific "Firm" pressure to ensure maximum contact between the heat sink and the chip. * **Plastic/Brass Pins:** Designed to fit into pre-drilled holes on the PCB. #### B. Material and Coating * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodization:** This is not just for aesthetics; the anodized coating increases emissivity, slightly improving radiative cooling and providing corrosion resistance. #### C. Thermal Performance The heat sink is designed for **forced air cooling**. The efficiency of the heat dissipation is measured by Thermal Resistance (°C/W). * **Low Airflow (100 LFM):** ~4.37 °C/W * **High Airflow (500 LFM):** ~1.46 °C/W *(Lower numbers are better, indicating the heat sink moves heat away faster as fan speed increases.)* --- ### 3. Applications This specific size (40mm) and height (20mm) is commonly used in: * **Telecommunications:** Network switches and routers. * **Embedded Computing:** Industrial PC motherboards. * **Power Electronics:** Cooling MOSFETs or Voltage Regulators. ---
    ✨ Follow-up Questions
    • ⤷ What is the difference between pushPIN and adhesive thermal tape for mounting?
    • ⤷ How do I calculate if this heat sink is sufficient for a 10-watt processor?
    • ⤷ Does the 'C2' in the part number refer to the thermal interface material (TIM)?