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  • ATS-19A-101-C2-R0

  • AI
    The **ATS-19A-101-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** designed by Advanced Thermal Solutions (ATS). It is engineered for cooling integrated circuits (ICs) and other electronic components in high-airflow environments. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 1.02 °C/W (@ 200 LFM) | --- ### 2. Design & Component Features #### A. pushPIN™ Attachment System One of the most critical electronic aspects of this part is its mounting mechanism. It uses a **pushPIN™** system that includes: * **Compression Springs:** Provides precise pressure (Force) to ensure maximum contact between the component and the heat sink. * **Plastic/Brass Push Pins:** Designed to fit into pre-drilled holes in the Printed Circuit Board (PCB). #### B. Thermal Interface Material (TIM) The "C2" in the part number indicates that this unit comes pre-applied with **ATS-51**, a high-performance thermal grease. This eliminates the need for manual application during assembly and ensures minimal thermal resistance between the silicon die and the aluminum fins. #### C. Fin Geometry It features a **straight-fin** design. In electronics, this is optimized for "ducted" or directional airflow. This design minimizes pressure drop, allowing heat to be carried away efficiently by system fans. --- ### 3. Application Use Cases This part is typically found in high-power electronic systems where active cooling is present: 1. **Telecommunications:** Cooling network switches and routers. 2. **Embedded Computing:** High-speed processors in industrial PCs. 3. **Power Electronics:** Cooling MOSFET arrays or voltage regulators. ---
    ✨ Follow-up Questions
    • ⤷ What are the advantages of using pushPIN vs. thermal adhesive for mounting?
    • ⤷ How does the 'Blue Anodized' finish affect the heat sink's performance?
    • ⤷ What is the specific thermal conductivity of the ATS-51 thermal interface material?