The **ATS-19A-87-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their high-performance heat sink series, designed primarily for cooling electronic integrated circuits (ICs) such as BGA (Ball Grid Array) components. Below is the technical breakdown of its parts and specifications. --- ### 1. General Specifications This part is a **Push-Pin Heat Sink**, designed for secure mechanical attachment to a Printed Circuit Board (PCB). | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Fin Style** | Straight Fin | | **Attachment Type** | Push-Pin (Plastic or Brass) | | **Interface Material** | T766 (Thermal Interface Material pre-applied) | --- ### 2. Physical Dimensions The dimensions are critical for ensuring the part fits within the layout of the motherboard or device. * **Width/Length:** 35.00 mm x 35.00 mm * **Height:** 15.00 mm (Low profile) * **Pitch (Fin Spacing):** Optimized for high-velocity airflow. * **Hole Pattern:** 40.00 mm x 40.00 mm (Spacing between PCB mounting holes). --- ### 3. Thermal Performance Thermal resistance measures how effectively the part moves heat away from the chip. It is measured in degrees Celsius per Watt (°C/W). Performance improves as airflow (LFM - Linear Feet per Minute) increases. | Airflow Velocity | Thermal Resistance (Unducted) | | :--- | :--- | | **100 LFM (0.5 m/s)** | 13.16 °C/W | | **300 LFM (1.5 m/s)** | 4.88 °C/W | | **500 LFM (2.5 m/s)** | 3.24 °C/W | --- ### 4. Key Component Parts 1. **The Heat Sink Body:** Extruded aluminum with a blue anodized finish. The blue anodizing not only provides a professional look but also offers a slight increase in surface emissivity and corrosion resistance. 2. **Push-Pins:** These are the mechanical fasteners. The "R0" designation typically implies the use of standard plastic or brass push-pins with a stainless steel spring to provide consistent pressure. 3. **Springs:** High-tension springs ensure that the heat sink maintains "constant pressure" against the chip, which is vital for thermal transfer. 4. **TIM (Thermal Interface Material):** The base comes pre-applied with **T766** phase-change material. This fills the microscopic air gaps between the chip and the heat sink. --- ### 5. Part Number Decoder Understanding the "ATS-19A-87-C2-R0" nomenclature: * **ATS:** Advanced Thermal Solutions. * **19:** Series identifier. * **A:** Specific design iteration. * **87:** Size/Dimension code. * **C2:** Blue Anodized finish. * **R0:** Revision/Packaging code.