The **ATS-19B-207-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to describe its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 12.70mm | | **Attachment Type** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | ~6.39°C/W (at 100 LFM) | | **Flow Pattern** | Straight Fin | --- ### 2. Design and Components The heat sink is comprised of several key features that facilitate cooling: * **Straight Fin Geometry:** The "207" in the part number identifies the specific fin profile. Straight fins are optimized for unidirectional airflow (e.g., in a server rack or case with a dedicated fan). * **Push-Pin Attachment:** This model uses a spring-loaded push-pin mechanism. This ensures a precise, consistent pressure against the component, which is critical for minimizing the thermal interface resistance. * **Phase-Change Material (PCM):** These units typically come with a pre-applied **Thermal Interface Material (TIM)**, often a high-performance "T766" phase-change pad, which melts slightly during operation to fill microscopic air gaps between the chip and the aluminum. --- ### 3. Electronic Application This part is generally used in environments where PCB space is available for mounting holes. 1. **Electronic Cooling:** It is used to lower the junction temperature of integrated circuits to prevent thermal throttling or hardware failure. 2. **Compatibility:** It is designed for standard PCB hole patterns. The "C2" indicates the specific spring/pin strength and material used for the mounting. 3. **Efficiency:** At high airflows (500+ LFM), the thermal resistance can drop significantly (e.g., down to ~1.60°C/W), making it suitable for high-density networking equipment. ---