The **ATS-19B-26-C2-R0** is a specific electronic cooling component, categorized as a high-performance **Heat Sink**. It is manufactured by *Advanced Thermal Solutions (ATS)* as part of their "maxiFLOW" product line. --- ## 1. Technical Specifications The part number encodes specific physical and thermal characteristics designed for cooling Integrated Circuits (ICs) such as CPUs, GPUs, or FPGAs. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | maxiFLOW | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 1.42°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 20.00mm | | **Finish** | Blue Anodized | --- ## 2. Key Design Elements ### A. pushPIN™ Attachment Unlike adhesive tapes or simple clips, the **-R0** designation typically refers to the use of the **pushPIN™** system. This involves: * **Compression Springs:** Provide precise pressure to ensure optimal contact between the heat sink and the chip. * **Brass/Plastic Pins:** Secure the heat sink through pre-drilled holes in the PCB. ### B. maxiFLOW™ Fin Geometry The "B" in the part number refers to a specific fin pattern. The maxiFLOW design features a flared fin structure. * **Purpose:** It maximizes the surface area while reducing pressure drop. * **Benefit:** It is highly effective in systems where airflow is limited or comes from varying directions. ### C. Thermal Interface Material (TIM) These units generally come with a pre-applied high-performance thermal interface material (like **Chomerics T766**). This ensures there are no air gaps between the component and the heat sink, facilitating efficient heat transfer. --- ## 3. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **19B** | Series and Fin Design | | **26** | Specific Height/Form Factor code | | **C2** | Material/Finish Code (Blue Anodized) | | **R0** | Revision / Attachment Kit style | --- ## 4. Common Applications This heat sink is typically found in: 1. **Networking Hardware:** Switches and routers where high-speed processors generate significant heat. 2. **Embedded Systems:** Industrial PCs where reliability and vibration resistance (via pushPIN) are required. 3. **Telecommunications:** Base stations and signal processing units.